Thin-film Transistors White Papers

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Wyse Intel-Based 3000 Series Thin Client: Powerful, Highly Configurable
sponsored by Dell
WHITE PAPER: Get a quick look at the Wyse Intel-based 3000 series thin client, a solution capable of driving a range of applications.
Posted: 13 Nov 2014 | Published: 11 Nov 2014

Dell

WebSphere DataPower Integration Blade XI50B
sponsored by IBM
WHITE PAPER: Read this paper to learn about WebSphere DataPower Integration Blade XI50B, a specialized, high-performance hardware appliance that can empower you t improve competitiveness by helping to strengthen business connectivity with partners and customers, and between internal organizations, add specialized connectivity, integration and more.
Posted: 12 Apr 2012 | Published: 12 Apr 2012

IBM

Hyper-V Virtual Labs Tips and Tricks
sponsored by Veeam Software
WHITE PAPER: Check out this exclusive resource to uncover a complete list of tips and tricks for virtual lab testing in a Hyper-V environment, so you can eliminate as many risks as possible.
Posted: 01 Apr 2014 | Published: 01 Apr 2014

Veeam Software

Enterprise Solution Design for SAP HANA
sponsored by HP & Intel®
WHITE PAPER: In this resource, explore the three principles of great enterprise design—stability, scalability, and agility—and learn how to apply them to your SAP landscape with a focus on SAP HANA. Read on for best practices and key design considerations for implementing your SAP HANA enterprise-level solution.
Posted: 25 Sep 2013 | Published: 28 Feb 2013

HP & Intel®

Virtualizing the Client PC: A Proof of Concept
sponsored by Intel Corporation
WHITE PAPER: In this paper Intel IT explores a proof of concept study that examined the viability of abstracting the client operating system from the hardware platform using virtualization.
Posted: 21 Nov 2008 | Published: 21 Nov 2008

Intel Corporation

Green Computing beyond the Data Center - IT Briefing
sponsored by Faronics
WHITE PAPER: Organizations considering green computing initiatives start in the data center but the truth is that in many organizations more power and heat waste is generated outside of the data center. This white paper discusses seven actions that address the prob...
Posted: 28 Sep 2007 | Published: 01 Sep 2007

Faronics

First the Tick, Now the Tock: Next Generation Intel Microarchitecture - Nehalem
sponsored by Intel Corporation
WHITE PAPER: Read this paper and get a look at how the next generation microarchitecture's dynamically scalable and design-scalable features directly contribute to power efficiency and performance.
Posted: 03 Apr 2009 | Published: 02 Apr 2009

Intel Corporation

HP's latest management solution will help conquer data center challenges
sponsored by HPE and Intel®
WHITE PAPER: Take a look at this exclusive resource to find out how HP's new approach to infrastructure management can help you save time and money when confronting data center challenges.
Posted: 05 Feb 2014 | Published: 31 Oct 2013

HPE and Intel®

Two Billion Entry Directory Benchmark
sponsored by Oracle Corporation
WHITE PAPER: This benchmark evaluates Oracle Internet Directory performance under scales and throughput rates representative of those encountered in production use in both the communications industry and as part of large scale delivery architectures.
Posted: 10 Apr 2008 | Published: 01 Mar 2008

Oracle Corporation

IBM System x3650 M4 Servers Data Sheet
sponsored by IBM and Intel.
WHITE PAPER: Explore this datasheet to learn about a scalable server package that can save your enterprise money without sacrificing speed or availability.
Posted: 07 Jul 2014 | Published: 14 Sep 2013

IBM and Intel.